The PCB is mainly composed of Copper Clad Laminates (Copper Clad Laminates, CCL), semi-cured sheet (PP sheet), Copper Foil and Solder layer (also known as Solder Mask). At the same time, in order to protect the exposed copper foil surface and ensure the welding effect, PCB surface treatment is also needed, sometimes with characters for identification.
The PCB 4 layer board structure diagram is shown Figure.
Titanium anodes and copper foils are both important components in the manufacturing of printed circuit boards (PCB).
Titanium anodes are used in the electroplating process to deposit a thin layer of copper onto the surface of the PCB. During the electroplating process, the titanium anode is immersed in an electrolyte solution that contains copper ions. When a current is passed through the solution, the copper ions are reduced and deposited onto the surface of the PCB. The highly resistant nature of the titanium anode makes it ideal for use in the harsh chemical environment of the electroplating process.
Copper foils, on the other hand, are used as the conductive material in the PCB. The copper foil is laminated onto the substrate material, usually a layer of fiberglass-reinforced epoxy, to create the conductive paths that make up the circuitry. The thickness and quality of the copper foil can have a significant impact on the performance and reliability of the final PCB.
In summary, titanium anodes and copper foils are both important components in the manufacturing of PCB. The titanium anode is used in the electroplating process to deposit a thin layer of copper onto the surface of the PCB, while the copper foil is used as the conductive material in the PCB. Together, these components help to create the circuitry that is essential to the functionality of electronic devices.